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Epoxy resin generally refers to molecules containing two or more epoxy groups of organic compounds. With few exceptions, their relative molecular mass is not high. The molecular structure of epoxy resin is characterized by containing active epoxy groups in the molecular chain. Epoxy groups can be located in the terminal, middle or ring structure of the molecular chain.

Epoxy Pulling Rod

Due to the active epoxy groups in the molecular structure, they can cross-react with various types of curing agents to form insoluble polymers with three-dimensional network structure. Where molecular structure contains epoxy groups of polymer compounds collectively referred to as epoxy resin.

The cured epoxy resin has good physical and chemical properties. It has excellent adhesion strength to the surface of metal and non-metallic materials, good dielectric properties, small deformation and shrinkage, good dimensional stability, high hardness, good flexibility, stable to alkali and most solvents, Applied to national defense, national economy departments, for casting, impregnation, laminates, adhesives, coatings and other uses.

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