The Difference Between Single Sided Panel and Insulation Board Used in PCB

The single-sided printed circuit board was developed in the United States in the early 1950s with the advent of crystals. At that time, the main manufacturing method was the direct etching method of copper foil.

From 1953 to 1955, Japan used imported copper foil to make a paper phenolic copper foil substrate for the first time, and it was widely used in radios. In 1956, after the appearance of Japanese circuit board manufacturers, the manufacturing technology of single-panel immediately advanced. In terms of materials, paper phenolic copper foil substrates were mainly used in the early days. However, due to the low electrical insulation of phenolic materials, poor solder heat resistance and distortion, materials such as paper epoxy resin and glass epoxy resin were successively The single panel required for the development of consumer electronic devices is almost entirely made of paper phenolic substrate.